Samsung to announce mass production of 3nm chip next week: Report

Samsung Electronics is expected to announce mass production of 3-nanometer semiconductors next week, sources said Wednesday, beating foundry rival TSMC in the advanced chipmaking process.

The next-generation 3nm chips will be built on Gate-All-Around (GAA) technology, which Samsung says will enable up to 45% area reduction while delivering 30% better performance and lower power consumption. 50% less, compared to the existing process.

The South Korean tech giant presented its 3nm chips to US President Joe Biden last month during his visit to Samsung’s semiconductor factory here, Yonhap news agency reports.

TSMC, the world’s largest contract chipmaker, said it would begin mass production of 3nm chips in the second half of the year.

The two companies have been in fierce competition to outdo each other in bringing the most advanced and efficient chips to the mass market and to win customers for contract chip manufacturing.

Samsung, the world’s largest memory chipmaker and second-largest foundry player, said its 2nm process node is in the early stages of development, with mass production planned for 2025.

According to industry tracker TrendForce, TSMC took 53.5% of the global foundry market, followed by Samsung with 16.3%, in the first quarter of this year.

In 2019, Samsung unveiled a massive $151 billion investment plan in the logic chip and foundry sectors by 2030, as the tech giant plans to expand its leadership beyond the sector. of memory.


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(Only the title and image of this report may have been edited by Business Standard staff; the rest of the content is auto-generated from a syndicated feed.)

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